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LY-G850 semi-automatic 3 zones max 50x45cm big area hot air Align BGA rework station 220V 6800W
item ID: 65285
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LY-G850 semi-automatic 3 zones max 50x45cm big area hot air Align BGA rework station 220V 6800W
- Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn.
- PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the chips,make sure the rework rate.
- Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode[preheating,constant,warming,soldering,reflow soldering,cooling.
- Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction model weld,remove,mount,manual,realize semi auto and auto function ,meet customer’s requirement
- High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1 degree
- Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
- Top heater and mounting heater design 2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.
- High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result.
- Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )
Technology Parameter of LY-G850 BGA Rework Machine
| Power | 6800W |
| Up heater power | 1200W |
| Down heater power | 1200W |
| IR heater power | 4200W(2400W control) |
| Power supply | (Single Phase) AC 220V±10 50Hz |
| Position way | Optical lens+ Vshape holder+laser positioning |
| Temperature control | High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃ |
| Material | High sensitive touch screen+temperature control module+PLC+step drive |
| PCB Size | Max:500×450mm ， Min: 10×10mm |
| Thermo-couple Ports | 4pcs |
| Chips magnification times | 2-30 |
| PCB thickness | 0.5-8mm |
| BGA size | 0.8mm-8cm |
| Min.chips pitch | 0.15mm |
| Mounting BGA weight | 1000G |
| Mounting precision | ±0.01mm |
| Overall dimension | L670×W780×H850mm |
| Optical alignment lens | Motor drive can move front back right left |
| Weight of machine | About 90kg |
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