2017 new LY 5300 auto optical alignment system Mobile BGA rework station 2 zones 2500W
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2017 new LY 5300 auto optical alignment system Mobile BGA rework station 2 zones 2500W
Mobile rework video: https://youtu.be/cO5RII03_bU
Our BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc.
The main user is repairing shops and factory to provide the after-sales service and rework.
How to separate BGA chip from motherboard?
How to replace a new BGA chip?
Repair steps:
1) Separate the BGA chip from mother board –we called desoldering
2) Clean Pad
3) Reballing or replace a new BGA chip directly
4) Alignment/Positioning – Depend on experience ,silk frame ,optical camera
5) replace a new BGA chip – we called Soldering
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Power supply |
AC 220V±10% 50/60Hz |
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Total power |
Max 2500W |
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4 |
Heater power |
Upper temp.zone 1200W,Down temp.zone 1200W |
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5 |
Electrical material |
Driving motor+ smart temp.controller+color touch screen |
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6 |
Temperature controlling |
(high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1 |
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7 |
Locating way |
V shape slot,PCB support jigs can adjust |
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PCB size |
Max 140×160mm Min 5×5 mm |
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Applicable chips |
Max 80×80mm Min 1×1 mm |
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10 |
Overall dimension |
L450×W470×H670mm |
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11 |
Temperature Interface |
1 pcs |
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12 |
Weight of machine |
40KG |
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13 |
Color |
Blue+White Mini BGA rework station |
Nozzles : 3 top,1 bottom(Top 18*18mm,12*12mm,14*20mm,Bottom 25*25mm)
Thanks for your order!
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Questions, issues or concerns? I'd love to help you!